Norcomp

Beckwith Electronics

Hamburg, Illinois 62045
(618) 232-1139
(618) 232-1172 fax

NorComp

180 SERIES
FEATURES: Available in 5 sizes/positions (15, 26, 44, 62, 78). Approximately 65% higher density than standard D-Sub connectors. Low cost/ high performance stamped contacts. Interfaces with IBM PC/2. Metal shell provides EMI/RFI shielding. Plug shells have indents to provide grounding and additional retention. Connectors will fit in standard D-Sub backshells. MATERIALS: Shell: Steel with bright tin plating. Insulator: Glass-filled thermoplastic. U.L. rated 94V-0. Contacts: Male - Brass. Female - Phosphor bronze. Plating: Gold flash on entire contact. (Contact Beckwith Electronics for other plating options.)	Dip Solder High Density D-Sub Connectors

180 SERIES

FEATURES:

Available in 5 sizes/positions (15, 26, 44, 62, 78).

Approximately 65% higher density than standard D-Sub connectors.

Low cost/ high performance stamped contacts.

Interfaces with IBM PC/2.

Metal shell provides EMI/RFI shielding.

Plug shells have indents to provide grounding and additional retention.

Connectors will fit in standard D-Sub backshells.

MATERIALS:
Shell: Steel with bright tin plating.
Insulator: Glass-filled thermoplastic. U.L. rated 94V-0.
Contacts:
Male - Brass.
Female - Phosphor bronze.
Plating: Gold flash on entire contact.
(Contact Beckwith Electronics for other plating options.)

Dip Solder
High Density D-Sub Connectors

Ordering Information See hardware table for hardware options
Position		Part Numbers Dip Solder	Dimensions
Position		Part Numbers Dip Solder	A	B	C
15	Male	180-015-112-001	1.213	.984	.496
15	Female	180-015-212-001	30.81	24.99	12.60
26	Male	180-026-112-001	1.543	1.312	.496
26	Female	180-026-212-001	39.19	33.32	12.60
44	Male	180-044-112-001	2.087	1.852	.496
44	Female	180-044-212-001	53.00	47.04	12.60
62	Male	180-062-112-001	2.732	2.500	.496
62	Female	180-062-212-001	69.39	63.50	12.60
78	Male	180-078-112-001	2.638	2.406	.606
78	Female	180-078-212-001	67.00	61.11	15.39