824 Horan Drive, Fenton, Mo 63026
(636) 343-6463
(636) 343-7026 fax
| Frequency Control Products Environemntal and Mechanical Specifications | |
|---|---|
| GROUP 1 | |
| Temperature Cycling | +5 ppm max., -55°C to +85°C, 3 cycles, 2 hours max., reference to 25°C +3°C. |
| Thermal Shock | +85°C and -40°C. Exposure time at an extreme temperature for 5 min., 3 cycles. |
| Vibration | Frequency with an amplitude of 1.5mm sweeping between lOHz to 55Hz within 1 minute for 2 hours minimum on each axis (X, Y, Z) |
| Drop Test | Natural drop on a hard wood board at 75cm, 3 times. |
| Humidity | 85% RH at +85°C, 96 hours minimum |
| Marking Permanency | Dip units in solvent, 10 strokes with brush, 3 times. |
| Fine Leak Test | Helium leak, less than 2 x 10-8 atm.cc/sec. |
| Gross Leak Test | 100% in De-ionized H20 or Perfluorocarbon for 60s min. at 125°C |
| Solderability | Dip in solder (230°C +5°C) for 5 seconds. More than 95% of surface being tested should be coated uniformly with solder. |
| Lead Bend | Will withstand maximum obend of 90° reference to base for 2 bends. |
| GROUP 2 | |
| Temperature Cycling | +5 ppm max., -40°C to +85°C at 95% RH ten times for 24 hours, 3 cycles then for 2 hours at 25°C |
| Temperature Cycling | +5 ppm max., -40°C to +85°C at 95% RH ten times for 24 hours, 3 cycles then for 2 hours at 25°C +3°C. |
| Thermal Shock | +85°C and -40°C. Exposure time at an extreme temperature for 5 min., 3 cycles. |
| Vibration | Frequency with an amplitude of 1.5mm sweeping between 10Hz to 55Hz within 1 minute for 2 hours minimum on each axis (X, Y, Z). |
| Drop Test | Natural drop on a hard wood board at 75cm, 3 times. |
| Humidity | 85% RH at +85°C, 96 hours minimum |
| Marking Permanency | Dip units in solvent, 10 strokes with brush, 3 times. |
| Fine Leak Test | Helium leak, less than 2 x 10~ atm.cc/sec. |
| Gross Leak Test | 100% in De-ionized H20 or Perfluorocarbon for 60s min. at 125°C |
| Solderability | Dip in solder (230°C +5°C) for 5 seconds. More than 95% of surface being tested should be coated uniformly with solder. |
| GROUP 3 | |
| Drop Test | +5 ppm max. with natural drop on a hard wood board at 75cm, 3 times or shock test of 3000g x 0.3ms x fi sine wave, 3 directions. |
| Marking Permanency | Dip units in solvent, 10 strokes with brush, 3 times. |
| Sealing | 1 x 10-2 µPa.m3/s max. |
| Soldering | Lead wires should be soldered within 105 with the iron heated to a temperature no higher than 270°C |
| GROUP 4 (INTERNAL CRYSTAL) | |
| Temperature Cycling | +5 ppm max., -55°C to +85°C, 3 cycles, 2 hours max., reference to 25°C +3°C. |
| Thermal Shock | +85°C and -55°C. Exposure time at extreme temperature for 5 minutes, 3 cycles. |
| Vibration | Frequency with an amplitude of 1.5mm sweeping between lOHz to 55Hz within 1 minute for 2 hours minimum on each axis (X, Y, Z). |
| Drop Test | Natural drop on a hard wood board at 75 cm, 3 times. |
| Humidity | 85% RH at +85°C, 96 hours minimum Marking Permanency Dip units in solvent, 10 strokes with brush, 3 times. |
| Fine Leak Test | Helium leak, less than 2x10-8 atm.cc/sec. |
| Gross Leak Test | 100% in De-ionized HgO or Perfluorocarbon for 60s min. at 125°C |
| Solderability | Dip in solder (230°C + 5°C) for 5 seconds. More than 95% of surface being tested should be coated uniformly with solder. |
| Lead Bend | Will withstand maximum bend of 90° reference to base for 2 bends. |
| GROUP 5 | |
| Temperature Cycling | Soak for 30 minutes at -55°C and +85°C for 5 times, release to 25°C for 1 hour prior to measurement. |
| Thermal Shock | Keep at 80°C +5° for 96 +4 hours, release to 25°C for 1 hour prior to measurement. Keep at -30°C +5° for 96 +4 hours, release to 25°C for 1 hour prior to measurement. |
| Vibration | Frequency with an amplitude of 1.5mm sweeping between lOHz to 55Hz within 1 minute for 2 hours minimum on each axis (X, Y, Z). |
| Drop Test | Natural drop on a concrete floor at 1m for 3 times. |
| Humidity | 90% RH at +40°C, 96 +4 hours. |
| Solderability | Dip in solder the leads no closer than 1.5mm at (350°C + 10°C) for 5 +1 seconds. More than 95% of surface being tested should be coated uniformly with solder. |
| GROUP 6 | |
| Temperature cyclinq | Subject the resonator to a low temperature of -55°+2°C for 30 minutes, followed by a high temperature of +85°C +2°C. Cycling shall be replaced 10 times. Then release the resonator into the room condition for 1 hour prior to measurement. |
| Hiqh temperature | Subject the resonator to 85° +2°C (125°C for automotive) for 1,000 hours +12 hours. Then release the resonator into the room condition for 1 hour prior to measurement. |
| Low temperature | Subject the resonator to -55°C for 1,000 hours +12 hours. Then release the resonator into the room condition for 1 hour prior to measurement. |
| Humidity | Subject the resonator to 60° +2°C at 90 -95% RH for 1,000 hours +12 hours. Then release the resonator into the room condition for 1 hour prior to measurement. |
| Drop test | Drop the resonator onto concrete floor from the height of 1.0m at 3 times. No visible damage. |
| Vibration | Apply the resonator to vibration for 2 hours in the X, Y, Z axes with the amplitude of 1.5mm. The vibration shall be varied uniformly between the limits and returned to 10Hz in 1 minute. |
| Terminal strenqth | Apply I kg pulling force along with the direction of leads for 10 +1s. Lead shall be subjected to with stand against 90° bending in the direction of thickness. No visible damage. |
| Solderability | Dip the leads into the solution of 25% rosin and ethyl alcohol and then into the solder bath (60/40 Sn/Pb) for 2 +0.5 s at 235° +5°C. Then release the resonator into (he room condition for 1 hour prior to measurement. 95% min. lead terminals shall be wet with solder. |
| For SMD | |
| Soldering heat resistance | Reflow: Preheat 140° ~ 160° for 1min. max. temperature 230° +5°C and above 200°C for 20s max. and then leave in natural condition for 1 hour before measurement. |
| PCB bend strength | After soldered on the PCB, press it by up to 1mm and keep it for 5s, 5 times repeatedly. |
| For Automotive | |
| Temperature cycling | After being kept at room temperature, resonator shall be placed at -55°C. After 30 minutes at this temperature, resonator shall be taken out at room temperature for 15 min. then placed at temperature of +85°C.After 30 minutes at this temperature, resonator shall be returned to -55°C again. After 100 cycles, resonator shall be returned to room temperature. Then release the resonator into the room condition for 1 hour prior to measurement. |
| Salt spray | After being placed in a chamber at 35° +2°C, density 5 +1% (by weight) for 48 hours and then being placed in natural condition for 1 hour, resonator shall be measured. |
| Sulfuration | After being placed in a chamber with 1000ppm sulfur density for 24 hours, and then being placed in natural condition for 1 hour, resonator shall be measured. |
| GROUP 7 | |
| Temperature cycling | Subject the resonator to a 5 temperature variations at low temperature of -40°+ 2°C for 30 minutes, followed by a high temperature of +100°C + 2°C for 30 minutes in each cycle. Then release the resonator into the room condition for 1 hour prior to measurement. |
| High temperature | Subject the resonator to 85° +2°C for 500 hours +12 hours. Then release the resonator into the room condition for 1 hour prior to measurement. |
| Low temperature | Subject the resonator to -40°C for 500 hours +12 hours. Then release the resonator into the room condition for 1 hour prior to measurement. |
| Humidity | Subject the resonator to 65° + 2°C at 90- 95% RH for 500 hours +12 hours. Then release the resonator into the room condition tor 1hour prior to measurement. |
| Drop test | Drop the resonator onto a hardwood board with thickness of 3 cm from the height of 75cm at 3 times. No visible damage. |
| Solder heat resistance | Meet reflow conditions, see Fig. 1 |
| Vibration | Apply the resonator to vibration for 2 hours in the X, Y, Z axes with the amplitude of 1.5mm. The vibration shall be varied uniformly between the limits at frequency 10Hz to 500Hz or acceleration 10g. |
| Terminal strength | Apply 0.5 kg pulling force to each of the leads for 30 +5s. No visible damage. |
| Solderability | Dip the leads into the solution of RMA flux for 5 +0.5s under room temperature and then into the solder bath (60/40 Sn/Pb) for 5 +0.5s at 230° +5°C. Then release the resonator into the room condition for 1 hour prior to measurement. 95% min. lead terminals shall be wet with solder. |
| Leak test | Take measurement with a Helium leakage detector at 1 x 10-2pPa.m3/s max. |
| Requirements: Oscillating frequency deviation (from initial value): < +0.3°/o Capacitance change: < +20% | |
| Requirements: Oscillating frequency deviation (from initial value): < +10ppm | |
Figure 1
Aracon has been awarded IS09000/QS9000 certification. In the early design and development stage, we conduct extensive qualification tests to ensure that each of the units manufactured will meet the minimum reliability conditions as specified in the control drawings. Reliability tests include physical dimensions, hermeticity, solderability, humidity, operating life, heat and cold, thermal shock, aging, resistance to solder heat, flammability, lead strength, residual gas analysis, reflow. We will apply customer's test plan if it is more stringent than Abracon test plan.
Products have been 100% inspected and tested with Statistical Process Control (SPC) with CpK of 1.33 to make sure that our products meet quality standards. Our quality goals are:
Failure rate ( A ): Measure of failure per unit of time. The life failure rate is based on the exponential life distribution.
Failure in Time (FIT): Measure of failure rate in 109 device hours, e.g. 1 FIT = 1 failure in 109 device hours. Total Device hours (TDH): The total number of units in life test or operation multiplied by the time of test or operation.
Mean Time To Failure (MTTF): Mean of the life distribution for the population of devices under operation or expected lifetime of an individual, MTTF = 1/ A , which is the time where 63.2% of the population has failed. Example: For A = lOFITs, MTTF = 100 millions hours.
Confidence Level (CL): Probability level at which population failure rate estimates are derived from sample life test. The upper confidence level interval is used (60%).
Acceleration Factor (AF): A constant derived from experimental data which relates the times to failure at two different stresses.
Where:
Chi Square Distribution Function (60% Upper Confidence Level)
FAILURE IN TIME (FIT) = ( )x109MEAN TIME TO FAILURE (MTTF) = I/ x 109 hours
Example: No. of devices: 100, Total hours =1,000 hours, |
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