Aries Electronics

FEATURES:
Makes BGA devices socketable when used in lieu of soft solder balls.
Adds only .100 [2.54] height to profile when mated in BallLock^TM socket.
Pin configuration eases insertion into BallLock^TM socket and provides positive "snap" feature.

SPECIFICATIONS:
Pin is Brass Alloy 360, 1/2 hard per UNS C36000 ASTM-B-85.
Pin plating is 10 u [.25 um] min. Gold per MIL-G-45204 over 100 u [2.54 um] min. Nickel per QQ-N -290. Other plating options available. Consult Beckwith Electronics for details.
Contact current rating = 1 Amp.

MOUNTING CONSIDERATIONS:
See Aries BGA BallLock^TM Data Sheet 23002.