Aries Electronics

FEATURES:
Any grid size available on either 1.27mm [.050] or 1.50mm [.059] pitch.
Socket lid nests BGA package into female socket for a reliable, solderless electrical connection.
Blind inserts are either soldered or epoxied to customer's PCB for socket retention
Reliable 4-fingered contact with wiping action. Consult Data Sheet No. 23003 for Aries molded 16x16 BGA socket and 23002 for BallLock^TM Socket.

SPECIFICATIONS:
Body material is UL 94V-0 FR-4.
Contacts are Beryllium Copper Alloy per QQ-C-533.
Contact plating is either 100 u [2.54 um] min. 90/10 Tin/Lead per MIL-T-10727 or 10 u [.25 um] min. Gold per MIL-G-45204 over 30 u [.76 um] Nickel per QQ-N-290.
Solder ball terminations are 90/10 Lead/Tin.
Solder paste is 63/37 eutectic.
Solder mask is "dryfilm."
Screws are stainless steel.
Inserts are Brass Alloy per QQ-B-626, Tin plated.
Inductance <1nH/contact @ 100 MHz.
Capacitance<1pf/contact @ 100 MHz.
Contact resistance=10m 0hms initial, 20m 0hms @ 1000 cycles
Durability = 100 cycles.
Random vibration per EIA 364, Test Procedure 28, Test Condition V, Test Letter B.
Insertion Force=60 grams/contact avg. (based on a .030 dia. Tin/Lead plated hard test ball).
Socket accepts BGA devices with .030 [.76] dia. balls.

MOUNTING CONSIDERATIONS:
Suggested PCB pad size = .025+.003 [.64+.08] dia.
Suggested insert PCB pad size =.130 [3.30] dia.

"A"=BGA Package Size +.392 [9.96]
"B"=(No. of Positions per Row -1) x BGA Pitch
"C"=BGA Package Size +.010 [.25]
"D"=BGA Package Height - Ball Height +.245 [6.22]
"E"=BGA Package Size +.196 [4.98]