Aries Electronics

FEATURES:
Convert surface mount PQFP packages to a PGA footprint.
Available with or without .020 [.51] high stand-offs.
Consult Becwith Electronics for panelized form or for mounting of consigned chips.

SPECIFICATIONS:
Adapter body is black FR-4, .062 [1.58] thick, with 1 oz. min. Copper traces.
Pads are hot-air solder leveled.
Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B 16-85.
Pin plating is 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 over 100 u [ 2.54 um] min. Nickel per QQ-N-290.
Operating temperature=221°F [125°C].

MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.028 + .003 [.71 + .08] dia.
Will plug into standard PGA sockets.