FEATURES:
 Convenient, cost-effective means of converting DIP
style packaging to SOIC PC board layouts.
SPECIFICATIONS:
Socket body is black, UL 94V-0 Glass-filled Thermoplastic Polyester (PET).
PCB is black FR-4, .062 [1.58] thick.
Male adapter pin is Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85.
Male adapter pin plating is 200 u [5.08 um] min. 93/7
Tin/Lead per MIL-P-81728 over 100 u [2.54 um] min.
Nickel per QQ-N-290.
Collet contact pin body is Brass Alloy 360 1/2 hard per
UNS C36000 ASTM-B16-85.
Collet pin plating is 10 u [.254 um] min. Gold per MIL-G-
45204 over 100 u [2.54 um] min. Nickel per QQ-N-290.
4-fingered collet contact is Beryllium Copper Alloy per
UNS C17200 ASTM-B194-92.
Contact plating is 10 u [.254 um] min. Gold per MIL-G-
45204 over 50 u [1.27 um] min. Nickel per QQ-N-290.
Contact current rating= 3 Amps.
Operating temperature=221°F [105°C].
Insertion Force=180 grams/pin; Withdrawal Force=90 grams/pin; Normal Force=140 grams/pin; based on a
.018 [.46] diameter test lead.
Socket accepts leads .015-.025 [.38-.64] in diameter, .100-.125 [2.54-3.18] long.
MOUNTING CONSIDERATIONS:
Suggested PCB solder pad size=.028 [.71] min. width.
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Series 354000
DIP to SOIC Adapters
Correct-A-Chiptm Technology
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