Allows the use of .65mm pitch surface mount ICs in thru-hole designs.
Ideal for prototyping and testing/evaluating SSOP ICs.
Adapter can be cut to smaller sizes by end user.
Consult Beckwith Electronics for panelized form or for mounting of consigned chips.
Adapter body is black FR-4, .062 [1.58] thick, with 1 oz. min. Copper traces.
Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85.
Pin plating is 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 over 100 u [2.54 um] min. Nickel per QQ-N-290.
Current rating=1 Amp.
Operating temperature=221°F [105°C].
Suggested PCB hole size=.028 + .003 [.71 + .08] dia.
Will plug into standard IC sockets.
SSOP IC to DIP Adapter
"A"=No. of Pins per Row X .100 [2.54]
"B"=(No. of Pins per Row -1) X .100 [2.54]
"C"=(No. of Pads per Row -1) X .0256 [.65]