FEATURES:
Convert surface mount VQFP packages to a 13 x 13 PGA footprint.
Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
Pins are mechanically fastened and soldered to board using Aries' patented process, creating a reliable electrical connection and rugged contact.
Consult Beckwith Electronics for panelized form or for mounting of consigned chips.
SPECIFICATIONS:
Adapter body is FR-4 with 1 oz. min. Copper traces.
Pads are bare Copper protected with Entek® by Enthone to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling.
Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85.
Pin plating is 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 over 100 u [2.54 um] min. Nickel per QQ-N-290.
Operating temperature=221°F [105°C].
MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.028 + .003 [.71 + .08] dia.
Will plug into standard PGA sockets.
Tolerances:
|
Row-to-row: |
+ .003 [+ .08] |
|
Pin-to-pin: |
+ .003 [+ .08] |
non-cumulative |
All others: |
+ .005 [+ .13] |
unless otherwise specified |
|